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主要技术参数:
定位系统:有0位指示
切片厚度范围:
0.25-100μm可调:样品最大水平移位:20/28mm可定制
0.25-0.5μm,以0.25μm递进;样品最垂直平移位:60/70mm可定制
0.5-2μm,以0.5μm递进样本自动进给,自动回缩:12μm
2-10μm,以1μm递进;样本总回缩距离:600μm
10-20μm以2μm递进;切片调节最小分度值:0.5μm
20-50μm以5μm递进;修片调节最小分度值:1μm
50-100μm以10μm递进切片精度:±5%
修片厚度范围:
1-600μm:可调最大切片截面:50×70mm
1-10μm,以1μm递进;尺寸:520×450×300(mm)
10-20μm,以2μm递进;大容量碎屑槽
20-100μm以10μm递进;可定做整套夹头及刀座
100-600μm以50μm递进输入电源:AC220V/110V频率50/60HZ