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主要技术参数：
定位系统：有0位指示
切片厚度范围:0.5-60μm可调
样品最大水平移位：24mm
切片厚度设定范围：
0-2μm以0.5μm递进,样品最垂直移位：60mm
2-10μm以1μm递进，最大切片截面：50*70mm
10-20μm以2μm递进，标本调节方向,水平8°,垂直8°
20-60μm以5μm递进。切片厚度最小分度值：0.5μm
切片精度：±5%
外型尺寸：300*570*270mm
修片厚度范围：小手轮任意调节，刻度旋钮0.5-60μm。
刀架基座移动范围:前后±25mm左右±20mm
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